RFID Flip-Chip system DZJ-4000：
Both RFID Flip-Chip Systems are using Visual System to locate the chip and the antenna; make the throughput with almost 99.5% yield. Both models handle all processes in one system platform: antenna web handling, epoxy jetting, flip chip, final curing, and testing; suitable for all types of HF / UHF RFID Inlay.

Technical Specification：
Dimensions:DZJ-4000:5800mm*1500mm*1600mm
Bonding speed：3500 UPH （DZJ-4000）
Power Supply：AC 220V/50HZ
Power Supply：7KW
Bonding accuracy：±50μm
Wafer picking：（wafer）6、8
Chip specification：0.4～2.0mm
Compressed air： 0.45Mpa～0.6Mpa
Vacuum pressure： -80Kpa～-100Kpa
Material bandwidth：80mm—370mm
Bound point spacing：≥20mm